Description

Amkor is currently seeking a Sr. Director, Chiplets/FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based modules such as HDFO (High Density Fan-out) and other advanced IC package constructions for computing, networking and PC client market spaces. This person will be the primary interface with Tier 1 customers and Amkor's leading edge R&D center in South Korea.

Requirements

• Drive and coordinate development activities with customers and in conjunction with Amkor's development teams in Korea.
• Lead Tier 1 customer interface meetings, discussions and follow-ups during project development.
• Coordinate and collaborate with all company resources as are required to execute R&D projects that will meet and exceed all customer requirements.
• Program Manage cross functional teams comprised of design center, characterization resources, and  process development in R&D.
• Manage product development through development and initial production ramp.

QUALIFICATIONS:

• This position requires a Bachelor's degree in Engineering (Mechanical Engineering or Materials Science and/or graduate studies in these disciplines are highly preferred.) Master's degree is a plus.
• 12+ years of experience in semiconductor packaging development is required.
• The qualified candidate will be able to work independently in a global organization with demonstrated experience in IC package process development.
• The qualified candidate understands the IC package design environment, and trade-offs associated with package design during package process development for FCBGA and Heterogeneous Modules-based IC packages.
• A working knowledge of mechanical stress/ strain and IC package warpage derived from IC packaging materials is required.  IC packaging materials have very different material properties which manifest in stress and warpage during high temperature processing and temperature cycling.  
• Direct previous product management experience involving off-shore process development is highly desired.
• Deep knowledge of IC packaging materials, failure mode and reliability qualification procedures is required.
• Excellent written and verbal communication skills needed.
• This position requires 20% domestic and 20% international travel.
• Expertise in Fan-out IC Packaging, including Low density (LDFO), and high density (HDFO) is desired.
• Expertise in large body FCBGA packaging: warpage control, stress management, underfill and TIM materials is preferred.
• Working knowledge of semi-additive plating chemistries and equipment is desired.
• Familiarity with Design of Experiments and Statistical Process Control and adeptness with the creation of product marketing collateral is a plus.

LOCATION:

Tempe, AZ. This position has a hybrid schedule.  Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.